GOST 24715-81
GOST 24715−81 Connections soldered. Quality control methods
GOST 24715−81
Group B09
STATE STANDARD OF THE USSR
CONNECTION BRAZED
Quality control methods
Brazed and Soldered Joints.
Methods for Inspection of Quality
Valid from 01.01.83
prior to 01.01.88*
______________________________
* Expiration removed
by the decree of Gosstandart of the USSR from
(IUS N 10, 1987). — Note the «CODE"
Resolution of the USSR State Committee for standards, dated April 29, 1981 N 2182 validity period is set with
This standard applies to the basic types of brazed joints, made according to GOST 19249−73 all soldering methods.
The standard establishes methods of quality control of brazed joints for the detection of surface, internal and through defects listed in table.1.
Table 1
Defects of solder joints
Surface defects |
Internal defects |
Through defects |
Surface oxidation, surface pore, undercut and facing the surface: Naropa, nespi, General and local erosion |
Naropa, nespi, crack, internal pore, shrinkage, slag inclusion, flucome inclusion metallic inclusion, non-inclusion, General and local erosion, soldering residual stress, structural defects of solder joint (deviations of the structure from the given technical conditions) |
Naropa, nespi, General and local erosion, a combination of external and internal defects that lead to leaks |
Note. Nespa, soldering, residual stresses, General and local erosion, structural defects of solder joint reveals the methods of destructive testing (tab.5).
The choice of method or combination of methods of control (table.2, 3, 4, 5) for detecting defects of solder joints should be in accordance with the requirements to the quality of brazed joints standards, specifications and drawings, approved in the established procedure, and taking into account the size of actual detected defects and performance control methods.
Table 2
NDT methods for the detection of surface defects in the solder joints
Control |
Control method |
The description of the method |
Scope | |
Sensitivity (minimum size of detectable defects) |
Features of the method |
|||
Optical |
Visual Visual optical |
According to GOST 23479−79 |
To detect small defects less than 0.1 mm using optical devices with magnification up to 30. |
Compounds having available for inspection of the surface |
Penetrating substances — capillary |
Color Fluorescent Fluorescent- color |
According to GOST 18442−80 |
The accuracy of the method depends on the roughness of the controlled surface solder joints. Control — according to GOST 18442−80 |
Compounds having surface available for applying penetrants and inspection |
Eddy current |
Transformer Parametric |
Defects with opening of 0.0005−0.001 mm and depth 0.2 mm |
The roughness parameter of the surface connections — 40 µm. |
Compounds having surface available for converters fault detectors |
Note. The size of actual detected defects dependent on the technical characteristics of the applied inspection hardware, the design features of products and manufacturing technology.
Table 3
NDT methods to detect internal defects in the solder joints
Control |
Control method |
The description of the method |
Scope | |
Sensitivity (minimum size of detectable defects) |
Features of the method |
|||
Radiation |
Radiographic |
2−5% of the total thickness being radiographed material |
The sensitivity depends on the thickness and brands of the joined materials, and solders. Biological shield from ionising radiation in accordance with radiation safety norms and sanitary rules |
According to GOST 20426−75* |
Radioscopic |
3−8% of the total thickness being radiographed material |
|||
Acoustic |
Reflected radiation (the echo method) Past radiation Resonance Free oscillations Acoustic emission |
Defects with an area of 1 to 15 mmwhen the material thickness is 2.5−150 mm |
Detect defects of the type nepraev. Define the conditional size of the defect, equivalent area, configuration, and number of defects. |
Not limited, except for connections without access to input and reception of ultrasonic vibrations, and compounds with high damping of ultrasonic vibrations or having a thickness less than the dead zone of the instrument |
Heat |
Diplomaticheskii Thermometric |
According to GOST 23483−79 |
Detect defects of the type nepraev. It is necessary to create a heat flux in the direction perpendicular to the surface of the compound. Preparation and control — according to GOST 23483−79 |
Connections where the thickness of the layer facing the light receiver does not exceed 3 mm. Possible control of solder joints of electronic circuits and electrical circuits |
Electric |
Electric |
Is determined by the sensitivity of measuring equipment |
Assessment of the quality produce the largest electrical resistance or conductivity of the controlled area. The type and nature of the defect are not defined |
Compounds having the access for the measuring tips |
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* Standards 20426−82. — Note the CODE.
Notes:
1. When radiographic and radioscopic control is not provided detection of defects:
any defects, if their length in the direction of the radiation is less than twice the sensitivity of control, as defined by standards of sensitivity, or if the images of the defects coincide with other images, complicating the decryption (images of extraneous details, sharp angles of the product, abrupt changes of thicknesses of brazed items, etc.);
crack with opening less than 0.1 mm;
cracks, the plane of the disclosure which do not coincide with the direction of radiation;
nepraev in the case that the difference between the coefficients of attenuation of radiation solder and brazed material and the thickness of the solder joint do not provide enough radiation contrast.
Radiographic and radioscopic control should be used when bilateral access to the controlled solder connection, providing the ability to install source and radiation detector in accordance with the schemes of control.
2. The size of actual detected defects dependent on the technical characteristics of the applied inspection hardware, design features of the products and manufacturing technology.
Table 4
NDT methods for detection of through defects in the solder joints
Control |
Control method |
The description of the method |
Features of the method |
Scope | ||
The threshold sensitivity of leak detector, m·PA/s |
Formula for estimation of threshold sensitivity if the readout of the gas flow |
|||||
Proni- Causeni thing- States — period looking for |
Gas vye |
Radio active |
- |
- |
The threshold sensitivity ness of the tests depends on the technical characteristics of the used controls, design features controlled- the most of products and control technology. Requirements for selection of test methods, preparation and testing — according to GOST 24054−80 |
Determination of leakage of goods and (or) their components, and identifying individual leaks |
Manomet- also available |
- |
Methods of compression and vacuum Method chamber |
||||
The mass spec- tromet- also available |
Ways the vacuum chamber, the accumulation at atmospheric pressure, the crimping chamber crimping closed shells, blowing |
- |
||||
Halogen- NY |
10 |
- |
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Bubble- copy |
- |
Methods of compression and heating
|
||||
Ultra- sound |
10-10 |
- |
||||
Catroot- also available |
10 |
- |
||||
Chemicals- cue |
- |
- |
||||
Infra- red |
10 |
- |
||||
The Jew- coast nye |
The gidrost- automatic |
- |
- |
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Lumines- interest (color) |
- |
- |
||||
Electric cal |
- |
- |
Used in formulas: — volume of the product; — duration of the test; the volume of the chamber; — the smallest detectable bubble diameter; the surface tension coefficient; is the density of the indicator liquid; is the acceleration of free fall; — the height of the layer of indicator fluid; — atmospheric pressure; — pressure in the evacuated space above the layer of indicator fluid; the lower limit of the measuring gauge; — the time from the moment of formation of the bubble before its detachment.
Table 5
Methods of destructive testing
Control |
Control method |
The description of the method |
Scope | |
Sensitivity |
Features of the method |
|||
Destructive testing | The autopsy |
Identify the macroscopic and microscopic defects |
Quality of solder joint after opening of the plot is determined by visual inspection of the cut part and the results of metallographic, x-ray, chemical and other research |
Detection, setting the type, character and location of internal defects in the solder joints, if this is not applicable to other control methods |
Technology preview |
Identify the macroscopic and microscopic defects |
Samples of solder under the current soldering technology |
Not limited |
The use of other methods of quality control of brazed joints while ensuring sensitivity to guarantee detection of defects, which are unacceptable according to the requirements of technical documentation for the product, duly approved.
Specific control methods for solder joints must be specified in the technical documentation for the manufacture, acceptance and maintenance products.
To check the mechanical properties of the samples brazed joints subjected to impact tests according to GOST 23046−78, tensile GOST 23047−78 and bending according to GOST 24167−80.
Control technology of brazed joints must be established in the technical documentation developed in accordance with GOST 3.1102−74* and GOST 3.1502−74*".
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* Valid GOST 3.1102−81
** A GOST 3.1502−85. — Note the CODE.