Copper-molybdenum pseudoalloys
Equivalent
| Grade | analogue | W. Nr. | Aisi Uns | En | Order |
|---|---|---|---|---|---|
| MD25 | MoCu25 | Buy from stock, view availability | |||
| MD40 | MoCu40 | Buy from stock, view availability | |||
| MD50 | MoCu50 | Buy from stock, view availability | |||
| MD55 | MoCu55 | Buy from stock, view availability |
Pseudoalloy manufacture
Copper-molybdenum pseudoalloys of MoCu40 grade contains: copper (up to 40%), molybdenum (up to 60%), additives (not more than 0.04%). MoCu50 grade of pseudoalloys contains: copper (up to 50%), molybdenum (up to 50), additives (not more than 0.04%). Finished details must not have cracks, laminations, foreign inclusions, edge tears. There are products that serve in the capacity of initial substance for manufacture of billets (then sheets and strips): electrolytic copper powder PMS-1 (GOST 4960), nickel powder PNK-1L6 or PNK-1L5 (GOST 9722), metallic metallurgic of high purity according to technological conditions 48−19−69−80, molybdenum recovered powder or pseudoalloys grades MPCH according to technical conditions 14−22−160−2002.
Main properties
It has perfect heat conductivity, relatively low density, high leak-tightness. With a help of these pseudoalloys, there are can be manufactured products that possess unique application properties such as wearing resistance, heat resistance, high forging quality, self-lubrication capability, and low coefficient of friction. Specific electric and heat conductivity of alloys directly depend on relationship of residual porosity and main alloy components.
Chemical properties
Molybdenum reacts with salt, sulfuric acids only at a temperature of 80−100°C. Nitric, chloronitric acids dissolve molybdenum only at a temperature of 100 °C. It is resistant in cold alkali solutions, but it slowly fractures in hot alkali solutions. Additives of carbon, oxygen, silicon, aluminium, nitrogen, iron, sulfur, calcium and phosphorus that are included in commercial molybdenum significantly increase molybdenum properties. The main part of these additives makes molybdenum more brittle. The most detrimental additive is oxygen. If it constitutes 0.0008−0.004%, easy-melting oxides can lead to sharp increase of material brittleness and decrease of metal flow qualities (especially if there are present carbon and nitric). With increasing of oxygen percentage (more than 0.015%), molybdenum becomes brittle and cannot be pressure treated.
Physical properties of molybdenum
| Description | Identification |
| Temperature of characteristic receiving in °С | 20°С |
| Density [g/cm3] | 10.2 |
| Coefficient of linear thermal expansion α [1/°С] | 4.9x10-6 |
| Melting point is 1400° | 2620°С |
| Specific heat at 20 °C [J/(kg/deg)] | 0.256 |
| Heat conductivity K [V/m*K] | 142 |
| Specific electric resistance R Оhm-mm2/m | 0.054 |
Pseudoalloy application
Copper-molybdenum pseudoalloys are used in manufacture of metal-oxide semiconductors that have surface diffusion, heterojunction and field transistors for super-high or millimetric frequencies, integrated monolithic circuits, bipolar devices, containers for packaging of injection luminescent diodes and optoelectronics, electric power supply. Pseudoalloys are applied in the form of blankets for manufacture of different parts, sheets, and strips with a help of rolling. Pseudoalloys of MoCu40 and MoCu50 grades are requested in manufacture of products with high heat conductivity and for jointing of alumina and beryllium ceramics. In comparison to copper-tungsten pseudoalloys, copper-molybdenum are more lightweight. That is why they are applied in such items where low weight has a huge importance. Sheet that contains up to 70% of molybdenum are intended for stamping.
Supplier
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