GOST 19248-90

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  ГОСТ 19248-90

GOST 19248−90 (ISO 3677−76) Solders. Classification and designation of

GOST 19248−90
(ISO 3677−76)

Group В00

STATE STANDARD OF THE USSR

SOLDERS
Classification and designation of

Solders.
Classification and designation

AXTU 0072

Date of introduction 1991−07−01

INFORMATION DATA

1. DESIGNED AND MADE with the USSR State Committee on management of quality and standards

DEVELOPERS

I. G. Nahapetyan, O. E. Spinel, A. V. Savchenkov

2. APPROVED AND put INTO EFFECT by Decision of the USSR State Committee on management of quality and standards from 27.06.90 N 1890

3. The check date — 1996

4. The standard introduced by the international standard ISO 3677−76

5. REPLACE GOST 19248−73

6. REPRINTING. August 1993

This standard covers solders designed for soldering metals, and establishes classification rules and signs of the solders.

The standard applies to newly developed solders.

1. CLASSIFICATION

1.1. Classification of solders is set according to the following criteria:

the degree of melting during soldering;

the temperature of melting;

the method of education;

main component;

ability to fluxing;

the method of manufacture;

kind of prefabricated.

1.2. The degree of melting during soldering solders are divided into:

molten;

partially molten, including composite (used in metal-ceramic brazing).

1.3. Temperature melting solders are divided into:

1) solders for low-temperature (soft) solder with a melting temperature not more than 450°C:

sobolevka (145°C),

fusible (>145450°C);

2) solders for high-temperature (hard) solder with a melting point over 450°C:

srednebelaya (>4501100°C),

high-melting (>11001850°C),

refractory (>1850°C).

1.4. The method of forming solders are divided into:

ready, including electrochemical (galvanic) and thermal vacuum;

formed during soldering (contact-reactive and reactive-flux).

1.5. To the main component solders are divided into:

gallium;

indium;

bismuth;

tin-lead;

tin;

cadmium;

lead;

zinc;

aluminum;

germanium;

magnesium;

silver;

copper-zinc (brass);

copper;

cobalt;

Nickel;

manganese;

gold;

palladium;

platinum;

titanium;

iron;

zirconium;

niobium;

molybdenum;

vanadium.

1.6. On ability to fluxing solders are divided into:

frusemide;

camofluage.

1.7. The method of manufacture solders are divided into:

cast;

drawn;

rolled;

pressed;

crushed;

sintered;

stamped;

clad;

layered.

1.8. By type of prefabricated solders are divided into:

sheet;

tape;

tubular;

pasty;

wire;

preformed;

bar;

shaped;

powder;

molded.

2. MARKING

2.1. The designation of solders consists of three parts.

2.2. The first part contains the letter V, signifying the solder.

2.3. The second part contains a group of symbols of the chemical elements of the solder.

2.3.1. The first group of characters indicate the main element of the solder that determines its basic properties. Then, specify the numerical value of its mass fraction in percent. Mass fraction of other elements not specified. The precision of the mass fraction of element ±0,5% absolute value or ±1% relative magnitude.

2.3.2. Other chemical symbols indicate in descending order of mass fractions of elements. In case, if you solder two or more elements have the same mass fraction, specify them in order of decreasing atomic number.

2.3.3. The elements of the solder, mass fraction which is less than 2%, do not indicate, in addition to elements which have a significant effect on the properties of solders, precious and rare metals, if they are not impurities.

2.3.4. In the designation indicate no more than six chemical elements.

2.4. The third part contains the value of the temperature of the beginning and end of the melting point of the solder. For eutectic alloys indicate only the melting point.

Note. The precision of the temperature ±0.5% for solders used in the solid (high temperature) soldering, and ±2% at soft (low temperature) soldering.

Examples of symbols:

Eutectic solders containing 72% silver (main element) and 28% copper, with a melting point of 780°C:

B Ag 72 Cu 780.

A solder containing 63% Nickel (the basic element); 16% tungsten; 10% CR; 3.8 per cent iron; 3.2% of silicon; 2.5% boron; and 0.5% carbon; 0.6% phosphorus; 0.1% manganese and 0.2% of cobalt with a temperature of initial melting point of 970 °C and end of melting 1105°C:

B 63 W Ni Fe Cr Si B 970−1105

A solder containing 25% of tin (the main element); 73% lead and 2% antimony with the temperature melting point of 185 °C and end of melting point 260°C:

B 25 Sn Pb Sb 185−260

The text of the document is verified by:
the official publication of the
M.: standards Publishing house, 1993