GOST 17325-79

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ГОСТ 17325-79

GOST 17325−79 Soldering and tinning. Basic terms and definitions (with Amendments No. 1, 2)

GOST 17325−79*

Group В00

STATE STANDARD OF THE USSR

SOLDERING AND TINNING

Key terms and definitions

Brazing, soldering and tinning. Basic terms and definitions

Date of introduction 1981−01−01

Resolution of the USSR State Committee on standards of 11 October 1979, N 3914 time of the introduction set with 01.01.81

Proven in 1986

REPLACE GOST 17325−71

* REISSUE with Change in N 1, approved in April 1986 (IUS 7−86)

The Change N 2 approved and put into effect by the Decree of the USSR State Committee on management of quality and standards from 28.12.90 3463 N with 01.07.91

Change No. 2 made by the manufacturer of the database in the text IUS N 4 1991

This standard sets used in science, engineering and manufacturing of terms and definitions of basic concepts in the field of soldering and tinning of metals and non-metallic materials.

The terms set out in this standard are mandatory for use in all types of documentation, manuals, tutorials, technical and reference literature.

For each concept has a single standardized term. Unacceptable for use synonymous terms given in the standard as reference and marked «NDP». Synonymous terms without litters «NDP.» is given as reference data.

For certain of the standardized terms in the standard is shown as reference the short form, which can be used when a possibility of various interpretation.

Set definition, you can optionally change the form of presentation, preventing trespass of concepts.

In the case when the essential features of the concept are contained in the literal meaning of the term, a definition is not given and accordingly in the column «Definition» put a dash.

In the standard as reference is given to foreign equivalents for a number of standardized terms in German (D) English (E) languages.

The standard lists the indexes contained in this term in the Russian language and their foreign equivalents.

Standardized terms in bold, short form — bright, and synonyms in italics.

(Changed edition, Rev. N 2).

The term	Definition
GENERAL CONCEPTS
1. Soldering NDP. Brazed Spike Propeica D. E. Brazing; Soldering	Education permanent connection with interatomic bonds by heating the joined materials to temperatures below their melting point, their wetting by the solder (see PP.5 and 18), wicking of solder into the gap (see p. 17) and subsequent crystallization
2. Tinning NDP. Service D. Verzinnen E. Tinning	Education on the material surface of the metal layer by melting the solder, the solder wetting the surface and its subsequent crystallization
3. The solder connection D: Lotverbindung E. Brazed (soldered) joint	The connection is formed by soldering
4. Brazed material	The main material of workpieces or articles connected by soldering or subjected to tinning. Note. Main material and blank — graveyard 3.1109−82
5. Solder D. Lot E. Brazing alloy; Solder	The material for soldering and tinning with melting temperature below the melting temperature of the brazed materials
6. Auxiliary material D. Hilfsmaterial E. Auxiliary material	By GOST 3.1109−82 Note. To the auxiliary materials include: soldering fluxes, substances limiting solder spreading, etc.
7. Soldering flux Flux E. F. Flux	Auxiliary material used to remove oxides from the surface of soldered material and solder and prevent their formation. Note. Flux can participate in the formation of solder by separating it from the components decaying in soldering metal
8. The Paluda	The metal layer on the surface of the material formed when tinkering
9. Technological coating	The metal coating on the brazed material applied to protect it from oxidation during the heating involved in the contact melting and dissolving in the molten solder
10. The barrier coating D. Barrieruberzug E. Barrier coating	The metal coating on the brazed material applied to prevent contact of the material with solder or flow solder (see paragraph 16) on the surface, not be soldered (tinned) and insoluble or partially soluble in the molten solder
11. Wiring NDP. RASPAIL Raspisanie D. E. Unbrazing; Unsoldering	The separation of a brazed joint by heating it above the temperature of the initial melting point of the material of the solder joint (see p. 97)
12. Podpiska	Reheating solder joints and the introduction of a new portion of the solder with the aim of eliminating defects
13. Soldering D. Umloten E. Rebrazing; Resoldering	Wiring and re-soldering
14. Assembly clearances solder Assembly clearances D. Lotspalt bei Raumtemperatur E. Cold clearance	The gap between the surfaces of the brazed workpieces or the workpiece installed in the Assembly
15. Soldering gap D. Lotspalt bei Lottemperatur E. Hot clearance	The gap between the brazed surfaces of workpieces or articles formed at the soldering temperature
16. Solder spreading Spreading D. Ausbreinten E. Spreading	The spread of molten solder on the surface of the brazed material
17. Flowing solder in a gap Numb D. E. Flowing	Filling the molten solder in the soldering gap
18. The wetting of the solder Wetting D. Benetztn E. Wetting	Physico-chemical interaction of molten solder from brazed material, manifested in the spreading of the solder or the formation of the meniscus with the end-boundary corner wetting (see p. 24)
19. Desmetiana brazed material Desmetiana D. Entbenetzen E. Dewetting	The increase in wetting angle or reduction of the area of spreading of the solder (see paragraph 23) during the soldering or tinning compared to their initial values achieved. Notes: 1. Desmetiana is a consequence of chemical interaction between molten solder from brazed material and the time variation of their surface tension. 2. Under surface tension understand the force acting on a unit length of contour of the surface and tending to reduce the surface to a minimum predetermined volumes of the phases
20. Contact-reactive melting	The melting of the brazed materials in contact with each other or with technological coating, or with a metal strip at a temperature below the melting temperature of the most fusible of them
21. Solderability D. Lotbarkeit E. Brazability; Solderability	A property of a material to form a solder connection with a given mode of soldering (see p. 22)
MODE AND INDICATORS SOLDERING
22. Mode of soldering D. Lotdaten E. Brazing (soldering) data	The totality of parameters and conditions in which soldering is carried out. Notes: 1. Under settings, understand the soldering temperature, the holding time at this temperature, the rate of heating and cooling. 2. Under the terms of understand the method of heating, solder, flux (gaseous medium), the pressure on the mating workpiece, etc.
23. The area of spreading of the solder
24. The wetting angle of the solder Contact angle D. Randwinkel E. Contact angle	The dihedral angle between the plane tangent to the surface of the solder at the border of the wetting and wetted with solder flat surface brazed material. Notes: 1. Distinguish the equilibrium contact angle defined in rasnovsky system «brazed material-solder», and non-equilibrium contact angle, as defined in the state of the specified system other than equilibrium. 2. Under equilibrium system understand the system in which the contacting phases — solid and liquid — are in a thermodynamic equilibrium
25. Temperature of wetting by solder The temperature of the wetting D. Benetztnstemperatur E. Wetting temperature	The minimum temperature of the soldered material and solder at which the solder wetting
26. Soldering temperature D. E. Brazing (soldering) temperature	The temperature of the brazed material and the molten solder in the place of contact at which the formation of solder connections
27. The thermal cycle of the soldering D. E. Brazing (soldering) thermal cycle	The set values of temperature brazed materials and solder in the place of contact, which is heating, exposure and cooling during soldering
28. The temperature interval activity flux soldering D. Wirktemperaturbereich fur E. Working temperature range of the flux	The temperature range in which the soldering flux performs its functions
29. The minimum temperature of activity soldering flux	The minimum temperature in the temperature range of the active flux
30. The maximum temperature activity soldering flux	The maximum temperature in the temperature range of the active flux
31. The temperature of the desoldering D. E. Unbrazing (unsoldering) temperature	The minimum temperature of a brazed joint which, if not its the wiring under specified load and heating rate. Note: the load Value and the rate of heating — according to GOST 21547−76
32. The heating time when soldering The heating time D. Erwarmungsdauer E. Heat time	The time interval of heating of the brazed materials and solder in the place of contact from the ambient temperature up to brazing temperature
33. The dwell time at soldering The exposure time E. Soaking time	The time interval of exposure of the materials brazed and solder at soldering temperature
34. Cooling time soldering Cooling time D. E. Cooling time	The time interval of cooling of the brazed materials and solder from the soldering temperature to the ambient temperature
35. Total time soldering D. Gesamte Lotzeit E. Full brazing (soldering) time	The time interval is equal to the sum of the time of heating, soaking and cooling during soldering
36. The speed of solder wetting at the boundary corner wetting The speed of wetting D. Benetzensgeschwindigkeit E. Wetting rate	The ratio of the change of the wetting angle of the solder to the time interval over which the change occurred
37. The speed of solder wetting on the area of spreading of the solder The rate of spreading	The ratio of change of the area of spreading of the solder to the time interval over which the change occurred
38. The heating rate when brazing The heating rate D. Erwarmungsgeschwindigkeit E. Heat rate	The ratio of the change in temperature of the brazed contact material and solder to the time interval over which the change occurred
TYPES OF SOLDERING AND TINNING
39. Low-temperature soldering Soft soldering D. Weichloten E. Soldering	Soldering at a temperature not exceeding 723 K*
40. Brazing Brazing D. F. Brazing	Soldering at a temperature above 723 K*
41. Soldering finished solder	Soldering, which uses a pre-fabricated solder
42. Reflow soldering E. Reflow soldering	Pre-tinned soldering of workpieces or articles without the introduction of additional solder
43. The contact-reactive soldering	Soldering, in which solder is formed by the contact-reactive melting
44. Jet-soldering flux	Soldering, in which solder is formed by the decomposition of flux components
45. Sarcopic	Soldering of dissimilar materials, in which a more fusible material is heated locally to a temperature above its melting temperature and acts as a solder
46. Capillary soldering D. E. Capillary brazing (soldering)	Soldering in which molten solder fills the solder gap and is retained therein primarily the surface tension
47. Noncapillary soldering D.	Soldering in which molten solder fills the solder gap is mainly under the action of its weight or attached to it from outside forces
48. Picsware D. E. Braze welding	Noncapillary soldering, in which the joined edges of the blanks are shaped, like the groove in fusion welding*. Note. The groove — GOST 2601−84
_____________________ * The definition of the term-a synonym given in the Appendix.
49. Soldering flux (tinning) D. (Flubmittelver zinnen) E. Flux brazing (soldering, tinning)	Soldering (tinning) with flux
50. Bashlykova soldering (tinning) D. Flubmittelloses E. Fluxless brazing (soldering, tinning)	Soldering (tinning), in which the removal of oxides from the surface of the brazed material and the solder and prevent their formation apply gas environment or a vacuum, or destruction of the oxide film is carried out by ultrasonic vibrations or particles of solid material Note. Vacuum — GOST 5197−85
51. Soldering in the active gas medium D. E. Brazing in reducing atmosphere	Bashlykova soldering with the use of active gases or neutral gases with the addition of the active gaseous substances
52. Brazing in a neutral gas environment D. E. Brazing in protective atmosphere	Bashlykova soldering with the use of an inert gas or a gas neutral with respect to the brazed materials and solders in the temperature range of heating, soaking and cooling
53. Soldering in vacuum D. E. Vacuum brazing	Bashlykova soldering with application of the rarefied gas at a pressure of below 10PA. Note. Rarefied gas — GOST 5197−85
54. Ultrasonic soldering (tinning) D. (Verzinnen) E. Ultrasonic brazing (soldering, tinning)	Bashlykova soldering (tinning) using ultrasonic vibrations
55. Abrasive sharpening	Besplanoe tinning with the use of friction material brazed with particles of solid material
56. Abrasive-crystalline tin	Abrasive plating, in which the particles of solid material are of primary crystals solder
57. Abrasive-cavitation tinning	Ultrasonic tinning solder containing particles of solid material
58. Soldering soldering iron D. E. Soldering with soldering iron	Soldering in which heating of the soldered material and solder is performed with soldering iron
59. Flame soldering D. E. Flame brazing (soldering)	Soldering in which heating of the soldered material and solder is performed with a gas burner
60. Brazing in a furnace D. E. Furnace brazing (soldering)	Soldering in which heating of the soldered material and solder is performed in a furnace
61. Induction brazing D. E. Induction brazing (soldering)	Soldering in which heating of the soldered material and solder is the heat released in them under the influence of electromagnetic fields
62. Soldering by dipping into molten solder D. E. Dip brazing (soldering)	Soldering in which heating of the brazed materials is carried out in a bath with molten solder
63. Soldering by dipping into molten salt D. E. Salt-bath brazing; Flux-dip brazing	Soldering in which heating of the soldered material and solder is performed in a bath of molten salt. Note. Molten salt can be simultaneously soldering flux
64. Soldering wave solder D. E. Wave soldering	Soldering in which heating of the brazed materials transported over the bath, and feed solder to the junction are standing wave of solder, which is excited in the bath. Note. Under standing wave understand the status of the environment in which the location of the maxima and minima of the displacement of the vibrating points of the environment does not change over time
65. Exothermic brazing D. Exothermisches E. Exothermic brazing	Soldering in which heating of the soldered material and solder is performed by heat generated during the exothermic reaction of the thermal reaction of the thermite mixtures
66. Soldering of heated gas D. E. Hot-gas soldering	Soldering in which heating of the soldered material and solder is heated by gas
67. Arc brazing D. E. Arc brazing	Soldering in which heating of the soldered material and solder is performed with the electric arc
68. Plasma soldering	Soldering in which heating of the soldered material and solder is performed by plasma
69. Electron beam brazing D. E. Electron beam brazing	Soldering in which heating of the soldered material and solder is performed with an electron beam
70. Soldering glow discharge	Soldering in which heating of the soldered material and solder is performed by a glow discharge
71. Soldering the resistor D. E. Resistance brazing (soldering)	Soldering in which heating of the soldered material and solder is performed by passing an electric current through them
72. Soldering light rays D. F. Light rays brazing (soldering)	Soldering in which heating of the soldered material and solder is performed light rays
73. Soldering infrared rays D. E. Infra-red brazing (soldering)	Soldering in which heating of the soldered material and solder is performed with infrared rays
74. Laser soldering D. E. Laser brazing	Soldering in which heating of the soldered material and solder is performed with a laser (radiation optical quantum generator)
75. Heated soldering blocks D. E. Block brazing (soldering)	Soldering in which heating of the soldered material and solder is contacted heated solid bodies
76. Soldering heating mats D. mit E. Heated pads brazing (soldering)	Soldering in which heating of the soldered material and solder is heat-emitting elements, mounted in a heat-resistant flexible covers
77. Electrolyte soldering	Soldering in which heating of the soldered material and solder is performed during their contact with an aqueous electrolyte by passing a constant electric current of
78. Diffusion brazing	Soldering, in which the formation of solder joints is combined with isothermal processing. Note. Isothermal processing determines the time of diffusion with the purpose of the directed change of properties of the brazed joints, including the crystallization of the weld metal at the soldering temperature
79. Soldering under pressure	Soldering, in which the brazed materials are under pressure to reduce the soldering gap
80. Speed soldering D. E. Stage brazing	Mnogotomnym soldering of workpieces or articles with alternate formation of the solder seams in which there is no soldering or formation of defects in the previously formed compounds
81. Reflow the tinning	Tinned heating of the workpiece above the melting temperature of tinning with the aim of improving its quality
82. Simultaneous soldering	Mnogotomnym soldering of workpieces or products with simultaneous formation of the brazed seams throughout
83. Group soldering	Simultaneous soldering of multiple parts or products
84. Mechanized soldering (tinning) D. Mechanisiertes (Verzinnen) E. Mechanized brazing (soldering, tinning)	Soldering (tinning), carried out by mechanized method of execution of the process. Note. A mechanized method of performing the technological process GOST 23004−78
85. Automatic soldering (tinning) D. Automatisches (Verzinnen) E. Automatic brazing (soldering, tinning)	Soldering (tinning) carried out by the method of automatic execution of the process. Note. Automatic method execution of the process — according to GOST 23004−78
SOLDER JOINTS AND THEIR PARAMETERS _______________ * Sketches links to terms 88−94, 97, 101−103 given in GOST 19249−73.
86. Type solder joints D. Lotverbindungsart E. Brazed (soldered) joint type	Classification grouping of brazed joints allocated on the basis of the mutual arrangement and shape of the brazed elements. Note. Under element brazed understand the part of the workpiece or article is subjected to soldering
87. Typical cross-section of a brazed joint	The cross section of the solder joint, which identify its type
88. Lap-solder connection NDP. A brazed lap joint D. E. Lap braxed (soldered) joint	The solder connection where the brazed elements are connected by partially overlapping mutually parallel surfaces
89. Telescopic solder connection	Lap-solder connection of pipes or tubes with rod
90. Butt-solder connection NDP. Solder splice D. Stumplotverbindung E. Butt brazed (soldered) joint	The solder connection where the brazed elements located in one plane or on one surface of the connected end surfaces of
91. Kostykova solder connection NDP. The solder connection SCOs D. Schrage E. Scarf butt brazed (soldered) joint	Seam brazed connection, in which the angles between the end and side surfaces of the elements other than the direct
92. T-the solder connection NDP. The solder connection wtvr D. E. Tee brazed (soldered) joint	The solder connection, in which the lateral surface of the one solder element is connected to the other end or with its inner surface formed by the intersection of the first
93. Contact solder connection	The solder connection where the brazed elements are connected in line or at the point
94. Combo solder connection	Solder connection, representing different combinations of brazed joints lap, butt, kostykova, tee, telescopic contact
95. Consistent solder connection	The solder connection formed when brazing materials with the same or closest relative change in their linear dimensions when cooled
96. Inconsistent solder connection	The solder connection formed when brazing materials with dramatically different relative changes in their linear dimensions when cooled
97. A brazed joint D. E. Brazed (soldered) seam	Part of the solder joint, when soldering secretariatmolsa
98. Area fusing Spay D. Legierungszone E. Alloying zone	The surface between the brazed material and a brazed seam or border between them in the cross-section of a brazed joint
99. Diffusion area D. Diffusionszone E. Diffusion zone	Part of the solder joints with a modified chemical composition of the brazed material, as a result of mutual diffusion of components of the solder and the soldered material
100. Heat-affected zone D. E. Heat affected zone	Part of the solder joint is changed under the influence of brazing structure and properties of brazed material
101. The thickness of the solder joint D. E. Thickness of the brazed (soldered) seam	The distance between the soldering surfaces perpendicular to them
102. Length of the solder joint D. E. Length of brazed (soldered) seam	The length of the solder joint along the perpendicular to the plane of the typical section
103. The width of the solder joint D. E. Breadth of brazed (soldered) seam	The length of the solder joint in a typical cross-section of solder joints
104. The fillet area of the solder joint Fillet brazed seam	Part of the solder joint formed on the outer surfaces of the brazed elements
DEFECTS OF SOLDER JOINTS _______________ * Defects: «time», «the long chain», «shrinkage», «slag», «crack», «crack longitudinal», «transverse crack», «crack branched», «hairline fracture», «influx» — according to GOST 2601−84.
105. Naropa	Defect solder joints, which manifests itself in partial or complete failure to complete soldering of the solder gap
106. Nesby	Defect solder joints, manifested in the lack of grip brazed material with a material of the solder joint
107. The total chemical erosion during soldering Total erosion	Defect solder joints, manifested in the destruction of the brazed material in soldering, the developing evenly across the surface of its contact with the solder
108. Local chemical erosion during soldering Local erosion	Defect solder joints, manifested in the destruction of the brazed material in soldering, the developing in some areas its contact with the molten solder
109. Undercut when soldering Undercut	Defect solder joints, which manifests itself in the form of unfilled solder recesses in the brazed material at the fillet change of phase resulting from local chemical erosion
110. Soldering residual stress	Residual voltage present at the solder connection after cooling. Note. The residual stress to understand the stress remaining in the solder connection after elimination of factors that caused it in plastic deformation: mechanical, thermal, chemical
(Changed edition, Rev. N 1).
SOLDERS
111. Multilayer solders D. Mehrschichtlot E. Multilayer brazing alloy (solder)	Solder layers of metals or alloys that form when the temperature of the soldering alloy of a given composition
112. Flux cored solder D. Lotpulver E. Powder brazing alloy (solder)	Solders in the form of a powder or mixture of powders of metals or alloys, which forms at the soldering temperature solder of a given composition
113. Composite solders NDP. Metal-ceramic solder	Solders containing in its volume filler. Note. Under the filler understand the material used for the formation of solder in the gap of the system of capillaries or provide special properties of the connection
114. Molded solder D. Lotformteil Lotpulver E. Preformed brazing alloy (solder)	Solders in the form of blanks of a predetermined shape
115. Camofluage solder D. enhaltendes Lot E. Self-fluxing brazing alloy	Solders having the properties of flux
116. Tubular solder D. Seelenlot E. Cored solder	Solder, in the form of tubes or multichannel rod, the cavity of which is filled with flux or solder components
117. Solder paste D. E. Brazing (soldering) paste	A pasty mixture of solder powder flux and binder or with one of them. Note. Under a binder understand the substances contained in solder paste for the formation of connections between particles of the solder

(Changed edition, Rev. N 2).

ALPHABETICAL INDEX OF TERMS IN RUSSIAN LANGUAGE

The exposure time	33
The dwell time at soldering	33
The heating time	32
The heating time when soldering	32
Cooling time	34
Cooling time soldering	34
Soldering General	35
Fillet brazed seam	104
Desmetiana	19
Desmetiana brazed material	19
Length of the solder joint	102
Gap soldering	15
The gap Assembly	14
The gap Assembly solder	14
Numb	17
Flowing solder in a gap	17
The zone of diffusion	99
Area fusing	98
Heat-affected zone	100
Interval activity flux soldering temperature	28
Tinning	2
Tinning abrasive	55
Tinning abrasive-cavitation	57
The plating of the abrasive crystal	56
Tinning automatic	85
Tinning besplanoe	50
Tinning mechanized	84
Ultrasonic tinning	54
Tinning plysove	49
Material subsidiary	6
Material brazed	4
Brazed	1
Voltage residual solder	110
Naropa	105
Nespi	106
Maintenance	2
Reflow the tinning	81
Soldering	1
Soldering automatic	85
Soldering Bashlykova	50
Soldering in the active gas medium	51
Soldering in vacuum	53
Brazing in a neutral gas environment	52
Brazing in a furnace	60
Soldering wave solder	64
High temperature soldering	40
Soldering flame	59
Soldering finished solder	41
Pike group	83
Diffusion soldering	78
Soldering arc	67
Induction soldering	61
Soldering infrared rays	73
Capillary soldering	46
Soldering contact-reactive	43
Laser soldering	74
Mechanized soldering	34
Soft soldering	39
Soldering heating mats	76
Soldering of heated gas	66
Heated soldering blocks	75
Soldering noncapillary	47
Low-temperature soldering	39
Simultaneous soldering	82
Soldering soldering iron	58
Plasma soldering	68
Soldering by dipping into molten salt	63
Soldering by dipping into molten solder	62
Soldering under pressure	79
Reflow soldering	42
Soldering the reactive-flux	44
Soldering light rays	72
Soldering speed	80
Soldering solid	40
Soldering glow discharge	70
Soldering ultrasonic	54
Soldering flux	49
Exothermic brazing	65
Soldering electrolyte	77
Electron beam brazing	69
Soldering the resistor	71
Picsware	48
Paste soldering	117
Solderability	21
Soldering	13
Melting the contact-reactive	20
The area of spreading of the solder	23
Podpiska	12
Undercut	109
Undercut when soldering	109
The Paluda	8
The barrier coating	10
Coating technology	9
Propeica	1
Solder	5
The solder composite	113
The solder metal-ceramic	113
Solder a layered	111
Solder powder	112
Solder camofluage	115
The tubular solder	116
Solder molded	114
Raspisanie	Eleven
RASPAIL	11
Wiring	11
Spreading	16
Solder spreading	16
Mode of soldering	22
Sarcopic	45
The cross section of the solder joint characteristic	87
The heating rate	38
The heating rate when brazing	38
The rate of spreading	37
The speed of wetting	36
The speed of solder wetting at the boundary corner wetting	36
The speed of solder wetting area of the spreading	37
Wetting	18
The wetting of the solder	18
Connection brazed	3
The connection of brazed lap joint	88
Connection solder SCOs	91
The connection of brazed butt	90
Connection solder wtvr	92
Connection solder combo	94
Connection solder kostykova	91
The connection of brazed lap	88
The connection of the solder is inconsistent	96
Connection brazed consistent	95
The connection of the solder contact	93
The connection of brazed butt	90
The connection of brazed t —	92
Connection solder telescopic	89
Spay	98
Spike	1
The temperature of maximum activity soldering flux	30
Temperature activity soldering flux minimum	29
Soldering temperature	26
The temperature of the desoldering	31
The temperature of the wetting	25
Temperature of wetting by solder	25
Type solder joints	86
The thickness of the solder joint	101
The angle boundary	24
Wetting angle of the solder boundary	24
Plot of the solder joint fillet	104
Flux solder	7
Flux	7
Cycle soldering heat	27
The width of the solder joint	103
Seam brazed	97
Erosion local	108
The erosion of General	107
Erosion during soldering chemical local	108
Erosion during soldering chemical total	107

ALPHABETIC INDEX OF EQUIVALENTS TERMS IN GERMAN LANGUAGE

	11
	31
Ausbreiten	16
Automatisches	85
Automatisches Verzinnen	85
	10
Benetzen	18
Benetzensgeschwindigkeit	36
Benetzenstemperatur	25
	75
Diffusionszone	99
	69
Entbenetzen	19
	34
	32
	38
Exothermisches	65
	59
	17
	Seven
enhaltendes Lot	115
(Flubmittelver zinnen); flubmittelloses	49, 50
	47, 48
Gesamte	35
	40
	66
Hilfsmaterial	6
	61
	73
	58
	74
	98
	67
	72
Lot	5
Lotformteil Lotpulver	114
Lotpulver	112
	21
	22
	1
mit	76
	97
	103
	101
	102
	117
bei	15
bei Raumtemperatur	14
	26
	3
	86
	27
Mechanisiertes	84
Mechanisiertes Verzinnen	84
Mehrschichtlot	111
	60
Randwinkel	24
	51
	63
Schrage	91
	52
	64
Seelenlot	116
	46
	80
Stumplotverbindung	90
	92
	62
	88
	54
Ultraschallverzinnen	54
	13
	53
Verzinnen	2
	100
	39
	71
Wirktemperaturbereich	28

(Changed edition, Rev. N 2).

ALPHABETICAL INDEX OF THE TERMS IN ENGLISH

Alloying zone	98
Arc brazing	67
Automatic brazing	85
Automatic soldering	85
Automatic tinning	85
Auxiliary material	6
Barrier coating	10
Block brazing	75
Soldering Block	75
Brazability	21
Braze welding	48
Brazed joint	3
Brazed joint type	86
Brazed seam	97
Brazing	1, 40
Brazing alloy	5
Brazing data	22
Brazing in protective atmosphere	52
Brazing in reducing atmosphere	51
Brazing paste	117
Brazing temperature	26
Brazing thermal cycle	27
Breadth of brazed seam	101
Breadth of soldered seam	101
Butt brazed joint	90
Soldered Butt joint	90
Capillary brazing	46
Capillary soldering	46
Cold clearance	14
Contact angle	24
Cooling time	34
Cored solder	116
Dewetting	19
Diffusion zone	99
Dip brazing	62
Dip soldering	62
Electron beam brazing	69
Exothermic brazing	65
Flame brazing	59
Flame soldering	59
Flowing	17
Flux	7
Flux blazing	49
Flux soldering	49
Flux tinning	49
Fluxless brazing	50
Fluxless soldering	50
Fluxless tinning	50
Flux-dip brazing	63
Full brazing time	35
Full soldering time	35
Furnace brazing	60
Furnace soldering	60
Heat affected zone	100
Heat rate	38
Heat time	32
Heated pads brazing	76
Heated pads soldering	76
Hot clearance	15
Hot-gas soldering	66
Induction brazing	61
Induction soldering	61
Infra-red brazing	73
Infa-red soldering	73
Lap brazed joint	88
Soldered Lap joint	88
Laser brazing	74
Length of brazed seam	102
Length of soldered seam	102
Light rays brazing	72
Light rays soldering	72
Mechanized brazing	84
Mechanized soldering	84
Mechanized tinning	84
Multilayer brazing alloy	111
Multilayer solder	111
Powder brazing alloy	112
Powder solder	112
Preformed brazing alloy	114
Preformed solder	114
Rebrazing	13
Reflow soldering	42
Resistance brazing	71
Resistance soldering	71
Resoldering	13
Salt-bath brazing	63
Self-fluxing brazing alloy	115
Scarf butt brazed joint	91
Scarf butt joint soldered	91
Soaking time	33
Solder	5
Solderability	21
Soldered joint	3
Soldered joint type	86
Soldered seam	97
Soldering	1, 39
Soldering data	22
Soldering paste	117
Soldering temperature	26
Soldering thermal cycle	27
Soldering with soldering iron	58
Spreading	16
Stage brazing	80
Brazed Tee joint	92
Soldered Tee joint	92
Thickness of the brazed seam	103
Thickness of soldered seam	103
Tinning	2
Ultrasonic brazing	54
Ultrasonic soldering	54
Ultrasonic tinning	54
Unbrazing	11
Unbrazing temperature	31
Unsoldering	11
Unsoldering temperature	31
Vacuum brazing	53
Wave soldering	64
Wetting	18
Wetting rate	36
Wetting temperature	25
Working temperature range of the flux	28

APP (reference)

APP
Reference

Table 2

The term GOST 17325−79	The term ISO 857−79	Definition according to ISO 857−79*
40. Brazing	Brazing	Operations in which metal parts are joined using a filler metal having a temperature
39. Low-temperature soldering	Soft soldering	melting point lower than the melting point of the parts to be joined and wetting the parent metal. The base metal is not
48. Picsware	Picsware	melts at education connection.
39. Low-temperature soldering	Soft soldering	The operation in which metal parts are joined using a filler metal having a melting point below the melting point of the parts to be joined and below 450 °C and wetting parent metal. The base metal is not melted in the formation of compounds
40. Brazing	Brazing	The process of joining metals in which during or after heating, molten metal is drawn under the action of capillary forces into the gap between adjacent surfaces of the parts. The melting point of the filler metal is above 450 °C but always below the melting temperature of the base metal
48. Picsware	Picsware (including picoverse brass)	A method of brazing, in which the connection of the open type is obtained sequentially, like fusion welding, with filler metal, which has a melting point above 450 °C

______________
* The text of the column «Definition according to ISO 857−79» corresponds to the original. — Note the manufacturer’s database.

APP. (Added, Rev. N 2).

The text of the document is verified by:
the official publication of the
Welding, brazing and thermal cutting of metals.
Part 1. Terminology, classification
and equipment: Sat. Standards. -
M.: Publishing house of standards, 1990

GOST 17325-79

GOST 17325−79 Soldering and tinning. Basic terms and definitions (with Amendments No. 1, 2)

MODE AND INDICATORS SOLDERING

TYPES OF SOLDERING AND TINNING

SOLDER JOINTS AND THEIR PARAMETERS

DEFECTS OF SOLDER JOINTS

SOLDERS

ALPHABETICAL INDEX OF TERMS IN RUSSIAN LANGUAGE

ALPHABETIC INDEX OF EQUIVALENTS TERMS IN GERMAN LANGUAGE

ALPHABETICAL INDEX OF THE TERMS IN ENGLISH

APP (reference)

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GOST 17325-79

GOST 17325−79 Soldering and tinning. Basic terms and definitions (with Amendments No. 1, 2)

MODE AND INDICATORS SOLDERING

TYPES OF SOLDERING AND TINNING

SOLDER JOINTS AND THEIR PARAMETERS

DEFECTS OF SOLDER JOINTS

SOLDERS

ALPHABETICAL INDEX OF TERMS IN RUSSIAN LANGUAGE

ALPHABETIC INDEX OF EQUIVALENTS TERMS IN GERMAN LANGUAGE

ALPHABETICAL INDEX OF THE TERMS IN ENGLISH

APP (reference)

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