Solder Possu50-0,5
Designation
Name |
The value |
Designation GOST Cyrillic |
ПОССу50-0,5 |
Designation GOST Latin |
POCCu50-0,5 |
Transliteration |
POSSu50-05 |
The chemical elements |
ПSnPbSb50-0,5 |
Description
Solder Possu50−0,5 applies: for the production of ingots, round wire, round rods filled with flux tubes, powder used for tinning and soldering of aircraft radiators, soldering, food dishes, followed by tinned food with tin; for low-temperature (soft) capillary soldering of fittings from copper and copper alloys are designed for connection to copper pipes (according to GOST R 52318) used in drinking water systems, hot and cold water, water (steam) heating, cooling, sewage, water treatment plants and gas supply.
Note
Tin-lead solder measurementi.
Standards
Name |
Code |
Standards |
Non-ferrous metals, including rare metals, and their alloys |
В51 |
GOST 21930-76, GOST 21931-76, GOST 28873-90, GOST Р 52955-2008 |
Chemical composition
Standard |
S |
Ni |
Fe |
Cu |
As |
Al |
Zn |
Sn |
Sb |
Pb |
Bi |
GOST 21930-76 |
≤0.02 |
≤0.02 |
≤0.02 |
≤0.05 |
≤0.02 |
≤0.002 |
≤0.002 |
49-51 |
0.05-0.5 |
The rest |
≤0.1 |
GOST Р 52955-2008 |
≤0.02 |
≤0.02 |
≤0.02 |
≤0.08 |
≤0.03 |
- |
≤0.002 |
49-51 |
0.2-0.5 |
The rest |
≤0.1 |
Sn is the basis.
Mechanical characteristics
σB, MPa |
d |
kJ/m2, кДж/м2 |
Brinell hardness number, MPa |
Pig in the state of delivery |
≥37.28 |
≥62 |
≥431.2 |
≥13.2 |
Description mechanical marks
Name |
Description |
σB |
Limit short-term strength |
d |
Elongation after rupture |
kJ/m2 |
Toughness |
Physical characteristics
Temperature |
r, кг/м3 |
l, Вт/(м · °С) |
R, НОм · м |
20 |
8900 |
469 |
149 |
A description of the physical symbols
Name |
Description |
l |
Coefficient of thermal conductivity |
С |
Specific heat |