Solder POS90
Designation
| Name |
The value |
| Designation GOST Cyrillic |
ПОС90 |
| Designation GOST Latin |
POC90 |
| Transliteration |
POS90 |
| The chemical elements |
ПSnPb90 |
Description
Solder POS90 used: for the production of ingots, round wire, round rods filled with flux tubes, powder used for tinning and soldering of the inner seams of food utensils and medical equipment.
Note
Tin-lead solder antimony free.
Standards
| Name |
Code |
Standards |
| Non-ferrous metals, including rare metals, and their alloys |
В51 |
GOST 21930-76, GOST 21931-76, GOST 28873-90 |
Chemical composition
| Standard |
S |
Ni |
Fe |
Cu |
As |
Al |
Zn |
Sn |
Sb |
Pb |
Bi |
| GOST 21930-76 |
≤0.02 |
≤0.02 |
≤0.02 |
≤0.05 |
≤0.01 |
≤0.002 |
≤0.002 |
89-91 |
≤0.1 |
The rest |
≤0.1 |
Sn is the basis.
Mechanical characteristics
| σB, MPa |
d |
kJ/m2, кДж/м2 |
Brinell hardness number, MPa |
| Pig in the state of delivery |
| ≥48.07 |
≥40 |
≥411.6 |
≥15.4 |
Description mechanical marks
| Name |
Description |
| σB |
Limit short-term strength |
| d |
Elongation after rupture |
| kJ/m2 |
Toughness |
Physical characteristics
| Temperature |
r, кг/м3 |
l, Вт/(м · °С) |
R, НОм · м |
| 20 |
7600 |
5443 |
120 |
A description of the physical symbols
| Name |
Description |
| l |
Coefficient of thermal conductivity |
| С |
Specific heat |
