Solder POS61M
Designation
| Name |
The value |
| Designation GOST Cyrillic |
ПОС61М |
| Designation GOST Latin |
POC61M |
| Transliteration |
POS61M |
| The chemical elements |
ПSnPb61Cu |
Description
Solder POS61M used: for the production of ingots, round wire, round rods filled with flux tubes, powder used for tinning and soldering electrosolderers thin (thickness less than 0.2 mm) copper wires, foil, printed conductors in the cable, the electrical and electronic industry.
Note
Tin-lead solder-copper and antimony free. The use of solder for tinning and soldering in the crucible and the bath is not allowed.
Standards
| Name |
Code |
Standards |
| Non-ferrous metals, including rare metals, and their alloys |
В51 |
GOST 21930-76, GOST 21931-76, GOST 28873-90 |
Chemical composition
| Standard |
S |
Ni |
Fe |
Cu |
As |
Al |
Zn |
Sn |
Sb |
Pb |
Bi |
| GOST 21930-76 |
≤0.02 |
≤0.02 |
≤0.02 |
1.2-2 |
≤0.01 |
≤0.002 |
≤0.002 |
59-61 |
≤0.2 |
The rest |
≤0.1 |
Sn is the basis.
Mechanical characteristics
| σB, MPa |
d |
kJ/m2, кДж/м2 |
Brinell hardness number, MPa |
| Pig in the state of delivery |
| ≥44.15 |
≥40 |
≥107.8 |
≥14.9 |
Description mechanical marks
| Name |
Description |
| σB |
Limit short-term strength |
| d |
Elongation after rupture |
| kJ/m2 |
Toughness |
Physical characteristics
| Temperature |
r, кг/м3 |
l, Вт/(м · °С) |
R, НОм · м |
| 20 |
8500 |
4899 |
143 |
A description of the physical symbols
| Name |
Description |
| l |
Coefficient of thermal conductivity |
| С |
Specific heat |
