Solder ПДОл5П7 (PMI 5-5)
Designation
| Name |
The value |
| Designation GOST Cyrillic |
ПДОл5П7 |
| Designation GOST Latin |
PDOl5P7 |
| Transliteration |
PDOl5P7 |
| The chemical elements |
ПДSn5П7 |
| Name |
The value |
| Designation GOST Cyrillic |
ППМОФ 5-5 |
| Designation GOST Latin |
PPMOF 5-5 |
| Transliteration |
PPMOF 5-5 |
| The chemical elements |
ППCuSnP 5-5 |
Description
Solder ПДОл5П7 used: mechanized and manual processes high temperature brazing of copper and its alloys vysokomanevrennyh used instead of solders with different methods of heating (gas, HDTV, etc.).
Note
Solder is made by mechanical mixing of its constituent components-powders produced by atomization from a liquid phase with water or nitrogen.
Depending on granulometric composition and formability of the pressed powder is divided into ПДОл5П7-P (PMOF 5−5-P) and not pressed ПДОл5П7 (PMI 5−5).
ПДОл5П7-P: the powder Particles have a porous structure, so good shape with no cords and heating and is used for manufacturing of the embedded elements (rings, pills, etc.).
ПДОл5П7: Used in powder or paste obtained by mixing powders of flux ПВ209Х (GOST 23178) and the solder powder in the ratio 1:1 by volume diluted to a creamy state.
The developer of the technology — Vniiavtogenmash.
Standards
| Name |
Code |
Standards |
| Solid alloys, metal-ceramic products and powders, metal |
В56 |
TU 14-1-3709-84 |
Chemical composition
| Standard |
P |
Fe |
Cu |
Sn |
Sb |
Pb |
Bi |
O |
| TU 14-1-3709-84 |
6.4-8 |
≤0.2 |
The rest |
4.2-5.8 |
≤0.05 |
≤0.1 |
≤0.01 |
≤0.3 |
Cu is the basis.
According to TU 14-1-3709-84, the total mass fraction of impurities is ≤ 0.70%. The content of bismuth and antimony is guaranteed by technology. Powder consists of copper grade M1K (GOST 859) - 5.0%, tin of the first quality category (GOST 860) - 5.0%, copper-phosphorous grade MF10 (GOST 4515) - 90.0%. A copper-phosphorous alloy of the MF13 grade is acceptable.
Physical characteristics
| Temperature |
R, НОм · м |
| 0 |
77 |
A description of the physical symbols
| Name |
Description |
| R |
UD. the resistivity |
Technological properties
| Name |
The value |
| Soldering |
Solder is a composition of powders with different melting point. The process of melting and weld formation is in several stages. The melting temperature of 650-730 °C, soldering temperature 700-720 °C. the Solder provides high mechanical properties (18-20 kgf/mm2) and the tightness of brazed joints. The electrical resistance of the seam during soldering when soldering solder ПДОл5П7 is at the level of the solder RPS 25. |
