Copper DP-80 (T-80)
Designation
| Name |
The value |
| Designation GOST Cyrillic |
ДП-80 |
| Designation GOST Latin |
DP-80 |
| Transliteration |
DP-80 |
| The chemical elements |
ДП-80 |
| Name |
The value |
| Designation GOST Cyrillic |
Д-80 |
| Designation GOST Latin |
D-80 |
| Transliteration |
D-80 |
| The chemical elements |
Д-80 |
Description
Copper DP-80 used: for the manufacture by the method of single pressing electrical and electronic structural components (contacts, parts, RF connectors, parts of the waveguide nodes).
Note
The copper powder.
The material should be applied after the impregnation with compounds that protect against internal corrosion. Compositions for the impregnation in accordance with OST 4G 0.054.213.
Standards
| Name |
Code |
Standards |
| Solid alloys, metal-ceramic products and powders, metal |
В56 |
OST 107.460094.118-88, OST 107.460009.002-90 |
Chemical composition
| Standard |
Cu |
| OST 107.460094.118-88 |
The rest |
Cu is the basis.
Mechanical characteristics
| Section, mm |
σB, MPa |
d |
Brinell hardness number, MPa |
| Properties of the material to heat treatment at OST 107.460094.118-88 |
|
≥137 |
≥12 |
≥40 |
Description mechanical marks
| Name |
Description |
| Section |
Section |
| σB |
Limit short-term strength |
| d |
Elongation after rupture |
Physical characteristics
| Temperature |
r, кг/м3 |
| 20 |
8000 |
A description of the physical symbols
| Name |
Description |
| Е |
The normal elasticity modulus |
| l |
Coefficient of thermal conductivity |
| С |
Specific heat |
