Solder Possu5-1
Designation
| Name |
The value |
| Designation GOST Cyrillic |
ПОССу5-1 |
| Designation GOST Latin |
POCCu5-1 |
| Transliteration |
POSSu5-1 |
| The chemical elements |
ПSnPbSb5-1 |
Description
Solder Possu5−1 is used: for the production of ingots, round wire, round rods filled with flux tubes, powder used for tinning and soldering of components operating at elevated temperatures, for tin plating of tubular radiators.
Note
Solder tin-lead-antimony.
Standards
| Name |
Code |
Standards |
| Non-ferrous metals, including rare metals, and their alloys |
В51 |
GOST 21930-76, GOST 21931-76, GOST 28873-90 |
Chemical composition
| Standard |
S |
Ni |
Fe |
Cu |
As |
Al |
Zn |
Sn |
Sb |
Pb |
Bi |
| GOST 21930-76 |
≤0.02 |
≤0.08 |
≤0.02 |
≤0.08 |
≤0.02 |
≤0.002 |
≤0.002 |
4-5 |
0.5-1 |
The rest |
≤0.2 |
Pb is the basis.
Mechanical characteristics
| σB, MPa |
d |
kJ/m2, кДж/м2 |
Brinell hardness number, MPa |
| Pig in the state of delivery |
| ≥32.37 |
≥40 |
≥274.4 |
≥10.7 |
Description mechanical marks
| Name |
Description |
| σB |
Limit short-term strength |
| d |
Elongation after rupture |
| kJ/m2 |
Toughness |
Physical characteristics
| Temperature |
r, кг/м3 |
l, Вт/(м · °С) |
R, НОм · м |
| 20 |
11200 |
3517 |
200 |
A description of the physical symbols
| Name |
Description |
| l |
Coefficient of thermal conductivity |
| С |
Specific heat |
